Conference preview: China Intellectual Property & Innovation Summit 2018
CIPIS 2018, from April 11 to 13 in Shanghai, will welcome more than 600 IP counsel from different industries such as telecommunications, electronics, software, pharmaceuticals, and aerospace. Conways Asia reports.
The China Intellectual Property & Innovation Summit 2018 (CIPIS 2018) will be held on April 11 to 13, 2018, in Shanghai, China. To cover a wider range of IP topics, the original two-day event has been upgraded to span three days and is now fully subscribed.
After China’s 19th CPC National Congress last October, the country clearly showed its intent of fostering a culture of innovation and strengthening the creation, protection, and application of IP.
The growing global power of Chinese companies, combined with the rapid expansion of China’s domestic market, is causing dramatic IP strategy implications for businesses around the world. It has brought not only new horizons and new opportunities for the IP industry, but also new resources and new challenges.
More than 600 IP counsel from different industries such as telecommunications, electronics, software, pharmaceuticals, and aerospace are to join CIPIS 2018 in Shanghai, China.
Hot topics for CIPIS
Day one:
An overview of the patent linkage system of China;
New positioning of the ‘three-step method’ in patent examination;
Patent mining and mapping;
Getting lost in the first generics market;
The country’s first law on traditional Chinese medicine; and
IP strategy in M&A transactions.
Days two and three:
The new direction of IP protection strategy under the ‘Belt and Road’ initiative;
The changing China trademark landscape;
The significance and trends of civil law of the PRC confirming that trade secrets are IP;
Where next for the US patent pendulum?
Brand protection strategies;
How Chinese enterprises deal with patent disputes;
Punitive damages and wilful infringement;
FRAND terms and SEPs in China;
IP management at the artificial intelligence (AI) frontier; and
IP capital: IP and finance.
Previous years’ speakers
SIOP: Head of patent management department
Shanghai IP Court: Director
LeTV: Vice president of global patents
Alibaba: IP director
ZTE Corporation: Chief IP officer
Huawei: Director of IP
Samsung: Global vice president
LG: Global vice president
TSMC: Chief IP consultant
Unilever China: Head of patents
Akzo Nobel: Director of IP
Midea Group: Director of IP Center
IBM: Director of IP
Dolby Laboratories: Senior licensing director
China Aerospace Science and Industry Corporation: Director of IP
Geely: Vice president, head of IP
Lenovo: Director of IP
Participating enterprises, government bodies and associations
These include Huawei, Sogou, JD, Hisense, Tencent, Goer Acoustic, LeTV, Yili, Baiyunshan Pharmaceutical, Alibaba, Samsung Display, Matsushita Singapore R&D Center, Matsushita Electric China, China Mobile, Midea Group, COFCO Group, Philips, NXP, Geely Automobile, Zhejiang University, Tongji University, DT Mobile, Shanghai Pharmaceutical, Continental Automotive, Hikvision, Solvay, Fosun Pharma, Qihoo 360, ZTE, Yinjiang shares, TCL China Household Electrical Appliances, China Resources Microelectronics, Phoenix Contact, SIOP, CFDA, Chinese Academy of Sciences, Guangzhou Institute of Biomedicine and Health Chinese Academy of Sciences, China Technology and Exchange.